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Key material portfolio for semiconductor manufacturing

Our advanced range of materials is engineered to deliver exceptional sealing integrity in critical semiconductor processes. Our quality, consistency and technical expertise give you confidence.
Our advanced range of materials is engineered to deliver exceptional sealing integrity in critical semiconductor processes. Our quality, consistency and technical expertise give you confidence.
We offer ultra-pure Isolast® PureFab® elastomers, high-performance engineered plastics and Turcon® PTFE & Zurcon® materials – advanced solutions that reduce downtime, boost efficiency and improve yields while lowering total cost of ownership.
Through global in-house material development, robust testing and ongoing application innovation, we help keep your processes efficient, reliable and ready for tomorrow’s semiconductor challenges.
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Isolast® PureFab® FFKMs for semiconductor applications

We offer a comprehensive portfolio of Isolast® PureFab® perfluoroelastomers (FFKMs), engineered to set a benchmark for purity, reliability and performance in semiconductor manufacturing. With high-temperature stability, ultra-low trace metal content and outstanding plasma resistance, PureFab® materials minimize particle generation and outgassing, protecting your most advanced processes from contamination.

The Isolast® PureFab® range includes a variety of specialized material grades - such as JPF10, JPF11, JPF22, JPF23, JPF24, JPF31, JPF41, JPF42, and JPF44.

The latest additions are next-generation fluorosurfactant-free materials for semiconductor sealing JPF50, JPF58 and VPF20.
These solutions help you maximize process yield, extend maintenance intervals and lower total cost of ownership, all produced with global consistency and dedicated local support for critical process needs.

Isolast_Purefab_JPF41 JPF42 JPF44 JPF58 01

Key characteristics:

  • Exceptional purity: Ultra-low trace metal content and minimal outgassing reduce contamination risks in plasma, thermal and wet processes, ensuring clean operation for sensitive semiconductor applications.
  • Superior performance: Offers outstanding plasma resistance, high thermal stability and excellent chemical compatibility for both wet and dry process environments.
  • Long-term reliability: Combines superior mechanical strength with low compression set to ensure dependable sealing performance and extend service life.
By building on decades of materials science expertise, Isolast® PureFab® provides the resilience and process compatibility needed to excel in the toughest high-end semiconductor applications. You can rely on consistent quality, global availability and technical expertise.
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High-performance engineered plastics

High-performance engineered plastics provide stability and thermal performance for demanding semiconductor environments. They are ideal for structural parts and components, supporting reliability in wafer processing and handling applications. These plastics help ensure consistent performance where harsh chemistries, mechanical stress and high temperatures are present.
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Product group images with applications

Turcon® PTFE & Zurcon® high-performance polymer materials

Turcon® PTFE ensures ultra-low contamination and chemical compatibility for critical sealing applications, while Zurcon® materials deliver strength and abrasion resistance. Together, these materials provide reliable performance across demanding semiconductor environments.

Material development, testing and application validation

Our in-house materials and R&D capabilities support customer-specific compound development, material characterization, comparison and failure investigation tailored exactly to your needs. Available methods include plasma resistance, compression set, SEM/EDS, TGA, DSC, cure analysis and mechanical testing that give you confidence to have the optimal sealing solution in place.

 

Laboratory and material data support making smart engineering decisions based on your requirements. Final suitability also depends on part geometry, installation, tool design, recipe, exposure, maintenance cycle and other conditions specific to your individual application.
Explore semiconductor material testing capabilities

From process conditions to material recommendation

A useful material recommendation starts with the complete operating and component profile. Here's some guidance on what information our semiconductor materials and application experts need to identify the optimal solution for you:
  • Process step, equipment platform, process chamber configuration and seal or component location.
  • Process gases, plasma chemistry, plasma type and cleaning media.
  • Operating temperature and pressure or vacuum range.
  • Static, reciprocating or rotary motion and speed where relevant.
  • Seal geometry, component design, mechanical load and mating surfaces.
  • Purity, trace-metal, outgassing, particle and leakage requirements.
With our shoulder-to-shoulder engineering approach, our polymer experts work together with you and guide you every step of the way from design to delivery. Your exact requirements are the center of attention with performance, purity and reliability being the top priorities. That is how we ensure our solutions are tailored to your needs.
Discuss your material requirements with our semiconductor experts

Technical questions and answers

  • 低カーボンフットプリントEPDMは、性能面に影響はありますか？　
    いいえ、これらのエラストマーは従来のEPDMと同等の用途性能を発揮します。
  • 低カーボンフットプリントEPDMエラストマーには、どのような再生可能原料が使われていますか？
    使用済み食用油、林業残渣、トール油などの再生可能資源を循環利用した原料に加え、使用済みタイヤ由来のリサイクル充填材を使用しています。

  • これらのエラストマーはどのように製品のカーボンフットプリントを低減するのですか？
    化石由来原料を循環型およびリサイクル原料に置き換えることで、製品のカーボンフットプリントを大幅に削減します。
  • 低カーボンフットプリントEPDMエラストマーはどのような分野で使用されていますか？
    自動車、エネルギー、水処理、一般産業製造などの分野におけるシール用途で使用されており、高い耐久性と環境性能の両立が求められる場面で活躍しています。
  • 低カーボンフットプリントEPDMエラストマーはどのような分野で使用されていますか？
    自動車、エネルギー、水処理、一般産業製造などの分野におけるシール用途で使用されており、高い耐久性と環境性能の両立が求められる場面で活躍しています。