Our unique and focused range of leading-edge materials delivers exceptional sealing integrity in critical semiconductor processes.
Any size of O-Ring from micro to giant, standard or custom, is available alongside custom-molded designs and bonded products. These can be manufactured in materials ranging from basic elastomer grades to high purity, plasma-resistant grades specifically developed for microchip manufacturers using the most advanced semiconductor technologies.
Developing and testing materials in-house and engaging in on-going programs of innovation, Trelleborg Sealing Solutions continues to support the future needs of the industry. Unique high-performance materials help reduce downtime while maximizing production efficiency, yields, and process reliability; ultimately reducing total cost of ownership.