Isolast® PureFab™ FFKM

Fully organic material for demanding high temperature applications

• Fully organic structure
• High purity
• Excellent fluorine and oxygen radical plasma resistance
• Low particle generation
• High-temperature stability over +300°C
• Excellent chemical resistance, including in steam and amines
• Suitable for processes including dry etching, stripping and remote plasma cleaning

A new level of plasma resistance for the most aggressive applications

• Advanced nanoparticle filler system providing minimal particle generation
• Maximum resistance to aggressive ion and radical rich plasma chemistries
• Excellent high-temperature stability to +320°C
• Suitable for use in all etch processes and critical tool locations where there is a requirement for extreme plasma resistance

Outstanding high temperature performance in challenging applications

• Proprietary filler system provides excellent oxygen plasma resistance and dimensional stability
• Minimum particulation in NF3 plasma
• Superior sealing force retention over long durations even at temperatures over +300°C extends seal life
• Suitable for etch, deposition and diffusion processes

Superior chemical compatibility for a wide range of semiconductor applications

• Reinforcing synthetic filler system maximizes mechanical performance
• Extremely low leachables according to SEMI F40/F57
• Excellent resistance to aggressive, amine-based chemicals
• Low trace metal content leading to high process yield
• Excellent chemical compatibility with common dry process gases in less critical processes
• Minimum particulation and weight loss upon exposure to a wide range of plasma process gases

Leading edge translucent material for critical applications

• Non-filled, translucent extreme purity material
• Extremely low trace metal content
• Unmatched thermal stability performance compared to competitors’ translucent materials, even at +300°C
• Suitable for ash and strip processes as well as applications that require low-sealing force

Ultra-high temperature perfluoroelastomer for demanding subfab applications

• Unique cross-linking chemistry provides a low compression set for long time periods ensuring sealing integrity
• Unrivalled thermal stability up to +327°C/+620°F
• Low outgassing properties
• Very low trace metal contamination compared to other high temperature, black FFKMs
• Excellent chemical compatibility with common dry process gases
• Minimum particulation and weight loss upon exposure to a wide range of plasma process gases