Trelleborg Sealing Solutions launches four best-in-class materials in its Isolast® PureFab™ range specifically engineered for critical semiconductor sealing applications. For original equipment manufacturers & Fabs, utilizing these unique perfluoroelastomer (FFKM) formulations will provide an increased product yield and decrease process defects. In turn, this reduces downtime, extends product maintenance cycles, gives greater process tool uptime, and results in a lower total cost of ownership.
With excellent mechanical properties, all the ‘Fab Four’ semiconductor materials demonstrate the highest purity of their kind, without compromising plasma resistance, outgassing and thermal stability. Individually, the materials are best-in-class for specific characteristics:

 

  • Isolast® PureFab™ JPF10 for remote plasma resistance with fully organic formulation
  • Isolast® PureFab™ JPF20 for overall plasma resistance and minimal particulation in harsh environments
  • Isolast® PureFab™ JPF21 for long-term thermal stability and low trace metal contamination
  • Isolast® PureFab™ JPF30 for its market leading high temperature rating and extreme purity in a translucent material
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Webinar – Isolast® PureFab™ FFKM Seals

Trelleborg Sealing Solutions material engineers and semiconductor experts introduce our expanded Isolast® PureFab™ portfolio and demonstrate how they can save time and costs for semiconductor manufacturers.

Features & Benefits of Isolast® PureFab™

  • High-temperature stability
  • Highest purity
  • Exceptionally low trace metal content
  • Outstanding plasma resistance
  • Best performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning, and thermal processing such as atomic layer deposition
  • Reduced particle generation and ultra-low outgassing performance in high vacuum conditions
  • Enables end-users to extend their product maintenance cycles while ensuring that process yield is maximized
  • All Isolast® PureFab™ seals produced and packed in a Class 100 (ISO5) cleanroom environment to ensure purity of product

Our Isolast® PureFab™ Porfolio

Trelleborg Sealing Solutions offers a unique and focused material portfolio to match process chemistry, system location and tool complexity:
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Isolast_PureFab_JPF10

Isolast® PureFab™ JPF10

Fully organic material for demanding high temperature applications

• Fully organic structure
• High purity
• Excellent fluorine and oxygen radical plasma resistance
• Low particle generation
• High-temperature stability over +300°C
• Excellent chemical resistance, including in steam and amines
• Suitable for processes including dry etching, stripping and remote plasma cleaning


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Isolast_PureFab_JPF20

Isolast® PureFab™ JPF20

A new level of plasma resistance for the most aggressive applications

• Advanced nanoparticle filler system providing minimal particle generation
• Maximum resistance to aggressive ion and radical rich plasma chemistries
• Excellent high-temperature stability to +320°C
• Suitable for use in all etch processes and critical tool locations where there is a requirement for extreme plasma resistance

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Isolast_PureFab_JPF21

Isolast® PureFab™ JPF21

Outstanding high temperature performance in challenging applications

• Proprietary filler system provides excellent oxygen plasma resistance and dimensional stability
• Minimum particulation in NF3 plasma
• Superior sealing force retention over long durations even at temperatures over +300°C extends seal life
• Suitable for etch, deposition and diffusion processes

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Isolast_PureFab_JPF22

Isolast® PureFab™ JPF22 

Superior chemical compatibility for a wide range of semiconductor applications

  • Reinforcing synthetic filler system maximizes mechanical performance
  • Extremely low leachables according to SEMI F40/F57
  • Excellent resistance to aggressive, amine-based chemicals
  • Low trace metal content leading to high process yield
  • Excellent chemical compatibility with common dry process gases in less critical processes
  • Minimum particulation and weight loss upon exposure to a wide range of plasma process gases
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Isolast_PureFab_JPF30

Isolast® PureFab™ JPF30

Leading edge translucent material for critical applications

• Non-filled, translucent extreme purity material
• Extremely low trace metal content
• Unmatched thermal stability performance compared to competitors’ translucent materials, even at +300°C
• Suitable for ash and strip processes as well as applications that require low-sealing force 

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Isolast_PureFab_JPF40

Isolast® PureFab™ JPF40

Ultra-high temperature perfluoroelastomer for demanding subfab applications

  • Unique cross-linking chemistry provides a low compression set for long time periods ensuring sealing integrity
  • Unrivalled thermal stability up to +327°C/+620°F
  • Low outgassing properties
  • Very low trace metal contamination compared to other high temperature, black FFKMs
  • Excellent chemical compatibility with common dry process gases
  • Minimum particulation and weight loss upon exposure to a wide range of plasma process gases 
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Our Entire PureFab™ Portfolio

Isolast® PureFab™ – The ultimate high purity, plasma sealing performance for critical semiconductor applications

 

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Semiconductor Sealing

Explore sealing solutions engineered to meet the needs of this industry

 

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Get in touch with our semiconductor experts to discuss sealing solutions for your application

 

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