Isolast® PureFab® Seals Produced and Packed in Cleanroom Environment

The Isolast® PureFab® range provides the best performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning, and thermal processing such as atomic layer deposition.

The range comprises of leading-edge Perfluoroelastomers (FFKMs) that offer unique properties including high-temperature stability, high purity, exceptionally low trace metal content, and outstanding plasma resistance. This leads to reduced particle generation and ultra-low outgassing performance in high vacuum conditions, enabling end-users to extend their product maintenance cycles while ensuring that process yield is maximized.

To ensure purity of product, all Isolast® PureFab® seals produced and packed in a Class 100 (ISO5) cleanroom environment.

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Trelleborg Sealing Solutions offers a unique and focused material portfolio to match process chemistry, system location and tool complexity:

lsolast® PureFab® JPF10:

Fully organic structure
High purity
Excellent fluorine and oxygen radical plasma resistance
Low particle generation
High-temperature stability over +300 °C
Excellent chemical resistance, including in steam and amines
Suitable for processes including dry etching, stripping and remote plasma cleaning

lsolast® PureFab® JPF20:

Advanced nanoparticle filler system providing minimal particle generation
Maximum resistance to aggressive ion and radical rich plasma chemistries
Excellent high-temperature stability to +320 °C
Suitable for use in all etch processes and critical tool locations where there is a requirement for extreme plasma resistance

Isolast® PureFab® JPF21:

Proprietary filler system provides excellent oxygen plasma resistance and dimensional stability
Minimum particulation in NF3 plasma
Superior sealing force retention over long durations even at temperatures over +300°C extends seal life
Suitable for etch, deposition and diffusion processes

Isolast® PureFab® JPF30:

Non-filled, translucent extreme purity material
Extremely low trace metal content
Unmatched thermal stability performance compared to competitors’ translucent materials, even at +300 °C
Suitable for ash and strip processes as well as applications that require low-sealing force

Other materials in the Isolast® PureFab® range:

Isolast® PureFab® J9675:

Fully organic formulation with excellent resilience
Ultra-low outgassing performance for advanced node photolithography applications
Suitable for damping applications where outgassing properties are critical

Isolast® PureFab® J9685:

Outstanding thermal resistance
Very low compression set
Operates in high-temperature thermal processes up to 325°C
Suitable for thermal processes such as ALD, oxidation/diffusion etc

Isolast® PureFab® J9610:

Superior chemical resistance for wet process applications
Very low extractables in aggressive wet process chemicals
Suitable for CMP, ECD and wet etch applications

Products:

O-Rings
Custom-designed seals including rubber-to-metal and rubber-to-plastic bonded products, such as wafer handling products
FlexiMold™ large-diameter joint free seals
Centering Rings (NW, KF, ISO)