Our Trelleborg semiconductor experts Alan Astbury and Dr. Murat Gulcur explain how advanced simulation capabilities can significantly accelerate your design and qualification times and reduce your costs.

Trelleborg Sealing Solutions offers semiconductor customers the unique capability to model the compression set of elastomers to predict seal lifetime using simulation-driven engineering. A significant advance on industry standard simulation compression set tests, using FEA analysis based on real-life data enables engineers to capture more accurate seal compression set data.

Key takeaways:

• Discover how our unique compression set analysis based on real-life data fed into finite element analysis (FEA) tools provides you with more accurate seal longevity data, even over long time periods
• Find out how FEA-based simulation can be applied to analyze and predict other seal attributes, including viscoelasticity, abrasive wear and thermal effects
• Learn how you can benefit from FEA-based analysis to inform material and design choices for bespoke processes and applications