Sealing solutions for semiconductor manufacturing

As trends promising huge growth, such as Artificial Intelligence (AI), 5G, machine learning, and high-performance computing, drive semiconductor manufacturers’ innovation, accelerating time to market while reducing total cost of ownership is becoming critical.

Miniaturization has brought feature sizes down to the smallest that are hardly imaginable, while architectures are continually becoming ever more sophisticated. These factors mean achieving high yields with acceptable costs is increasingly difficult for chipmakers, and they also intensify the demands on high-tech seals and complex elastomer components used in processing equipment, such as state-of-the-art photolithography systems.

Reduced product dimensions lead to components that are highly sensitive to contamination, so cleanliness and purity are more important than ever. Aggressive chemicals and plasmas utilized under extreme temperature and pressure conditions create a tough environment. Solid technology and reliable materials are therefore vital in maintaining high process yield.