高性能半導體密封解決方案
在這些條件下，特瑞堡密封系統的高性能密封件脫穎而出，可確保潔淨度、耐化學性並延長設備運行時間以實現最大產量。
特瑞堡密封系統的高純度 Isolast® PureFab® FFKM 全氟橡膠材料經過廣泛的開發和測試，可確保極低的金屬析出量和顆粒釋放。低電漿侵蝕率、高溫穩定性、出色的乾濕製程化學耐受性、以及出色的密封性將是可靠密封件的關鍵特性，同時降低整體擁有成本。為了確保產品的純度，所有 Isolast® PureFab® 密封件均在 Class 100 (ISO5) 無塵室環境中生產和包裝
全球的資源協助、在地專家的協助、和專門的半導體專家，這三大支柱確保了我們從設計、打樣、出貨、到批量生產階段都提供一流的服務水平。我們業界領先的的設計協助和數位化工具是提高性能的關鍵資產。
Products
Our diverse portfolio includes solutions such as O-Rings, CMP membranes and bonded slit valve door seals - delivering exceptional purity, process integrity and long-term reliability for demanding semiconductor environments.
Materials
Our advanced polymer materials, such as Isolast® PureFab®, offer ultra-high purity, exceptional chemical compatibility and outstanding thermal stability - delivering reliable performance for critical semiconductor processes.
Application expertise across semiconductor processes
Our solutions are engineered for critical plasma, subfab, thermal and wet semiconductor processes, using ultra-high purity materials that guard against contamination and stand up to harsh chemicals, plasma and extreme temperatures.
Plasma processes
We use ultra-high purity materials to create reliable, long-lasting seals for plasma processes that limit outgassing and contamination, supporting higher yields and consistent performance.
Subfab processes
Our advanced sealing solutions for subfab environments deliver reliable performance under extreme conditions. By maintaining ultra-clean standards and withstanding aggressive chemicals and thermal cycling, these components help ensure reliable system operation and consistent uptime.
Thermal processes
We deliver reliable sealing solutions for thermal processes with Isolast® PureFab® materials that combine robust mechanical strength and chemical compatibility. These seals endure high temperatures, are compatible with aggressive chemicals and help minimize particle generation, supporting reliable performance and clean production conditions that contribute to higher process yields.
Wet processes
Our Isolast® PureFab® seals deliver outstanding chemical compatibility and ultra-low extractables for wet processes. Engineered to minimize contamination and support clean operations, these solutions help maintain process integrity and consistent yields in demanding environments.
Research & development and global manufacturing
Our local for local strategy ensures design, prototyping and delivery are fast and adaptable, helping accelerate your time to market. As your development partner, we collaborate from concept to completion, accelerating time to market with rapid design and a steadfast commitment to innovation in semiconductor manufacturing.
Research & development
Trelleborg Sealing Solutions combines decades of engineering expertise with ongoing material innovation to deliver high-precision sealing solutions.
Our advanced R&D and material testing support compound development, material characterization, comparison, failure investigation and application-specific engineering decisions to maximize efficiency.
Global manufacturing footprint
Our global manufacturing network of more than 35 manufacturing facilities delivers fast, flexible production, consistent quality and local sourcing for responsive support and shorter lead times.
Among our dedicated semiconductor sites, Malta excels in cleanroom manufacturing, Tewkesbury, UK combines cleanroom manufacturing and R&D testing, including a plasma lab and Yongin, South Korea stands out as a leading R&D center with advanced plasma testing.
Semiconductor resources and technical guidance
Explore our resources to discover how Trelleborg's engineered polymer solutions can enhance your semiconductor manufacturing processes.
手冊
半導體聚合物解決方案
半導體產業的無與倫比密封解決方案
半導體產業的無與倫比密封解決方案
虛擬展示間
探索半導體的畫廊，取得獨特設計的解決方案，以加快產品上市時間。
In the Groove
Insights and Innovations
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On-demand semiconductor webinars
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Engineering tools for seal specification
Discuss your semiconductor application
Share your application-specific requirements and connect with our experts to find the optimal sealing solution. As a first step, the respective component, media and plasma exposure, temperature, pressure or vacuum, motion, purity limits and hardware help to kick-start conversations about reliable solutions. Our semiconductor experts will identify relevant products and materials and define the next engineering and validation steps together with you.