Trelleborg to Showcase Two New Isolast® PureFab™ FFKM Materials at Semicon Europa 2022
Chris Busby, Semiconductor Segment Director at Trelleborg Sealing Solutions, says: “With extreme temperatures and increasingly more aggressive chemical precursors used in semiconductor environments, reliable sealing solutions are essential to prevent premature failure. At Semicon Europa we are launching two significant additions to our Isolast® PureFab™ range, specifically engineered to address the challenges of critical semiconductor sealing environments.”
Two new materials
Isolast® PureFab™ JPF40 is an ultra-high temperature perfluoroelastomer (FFKM) developed for demanding sub fab applications and thermal processes, including rapid thermal processing (RTP), atomic layer deposition (ALD), and oxidation. The material offers unrivalled compression set performance at operating temperatures from +200 °C/+392 °F to +300 °C/+552 °F. This ensures sealing integrity for critical processes, withstanding peak application temperatures over +325 °C/+617 °F, the highest temperature capability of an elastomer material.
Isolast® PureFab™ JPF22 is an excellent all-round FFKM seal with superior chemical compatibility suitable for a wide range of semiconductor applications. The material offers excellent resistance to wet process chemicals and steam, as well as amine-based ALD precursors.
>> Find out more about our Isolast® PureFab™ materials
Isolast® K-Fab™ Seal
Additionally, visitors to Trelleborg’s stand will be able to discover its Isolast® K-Fab™ flange seal for critical subfab applications, which is temperature resistant for use up to +327 °C/+620 °F dependent on the material selection. It is suitable for combination with both aluminum or stainless steel and for manufacture from a range of elastomer materials including Isolast® FFKM, Isolast® PureFab™ FFKM, PureFab™ Fluoroelastomer (FKM) for ultra-high purity, and standard FKM.
About Semicon Europa 2022
Held over three days and themed Chips Powering the Data Age, Semicon Europa is an international trade fair for semiconductor technology. It brings together visionaries and experts to focus on innovations in advanced technologies such as Smart Mobility, Smart MedTech, advanced packaging, fab management, materials, and other semiconductor industry growth drivers, and will highlight challenges and opportunities in sustainability, workforce development and across the supply chain.
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