98% amorphous Silica (SiO2)

Controllable moisture content

Chemically stable

High strength

Particle size control

Low density

Lower viscosity per unit addition

No leeching or cross-reactions with resins

Long material life span with low maintenance 
Dielectric applications

5G equipment in electrical connectors

Copper Clad Laminates (CCL)

Radar transparent coatings

Low dielectric potting complexes

Microwave materials

Antenna materials

Cable sheathing/cores

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Eccosphere® calculated values for dielectric constant and thermal conduct
1. Calculated with pure silice Dk od 3.6 and internal gas Dk of 1.0
2. Maxwell model

Illustration of Eccospheres® for use in 5G antenna base stations