As electronic equipment becomes increasingly compact with corresponding signal and power density, it is essential dielectric properties are customizable for each industry and application. Trelleborg’s Eccospheres®, which are hollow glass microspheres, solve the below requirements for dielectric materials:
Engineered product: Specialized material that can be tailored to each application, unlike naturally occurring dielectric additives such as Ground Calcium Carbonate (GCC), Precipitated Calcium Carbonate (PCC), Kaolin or Talc
Chemically stable: Industry-leading silica purity provides long life stability without leaching or negative resin interactions
Reduced loss tangent: A chemically stable and low-density particle structure that reduces the dielectric constant (Dk), which results in a better attenuation properties
Customizable material: A material that can be tailored to control density and strength, surface functionalization, moisture content and particle size
Strong processability: Maximize particle loading while maintaining processability due to high roundness, inert chemistry and low additives
Mechanical process survivability: Engineered to be resilient, and when processed through film and nip rollers can consequently reduce waste.
Controllable moisture content
Chemically stable
High strength
Particle size control
Low density
Lower viscosity per unit addition
No leeching or cross-reactions with resins
Long material life span with low maintenance
5G equipment in electrical connectors
Copper Clad Laminates (CCL)
Radar transparent coatings
Low dielectric potting complexes
Microwave materials
Antenna materials
Cable sheathing/cores
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| Specified Values | Calculated Values | ||||||
| Grade | Nom. Density (kg/m3) | Diameter (μm) | Wall Thickness (μm) | Dielectric Constant1 | Thermal Conduct (W/mK)2 | ||
| SI100 | 100 | 65 | 0.49 | 1.22 | 0.052 | ||
| SI130 | 130 | 65 | 0.65 | 1.15 | 0.061 | ||
| SI200 | 130 | 60 | 0.93 | 1.24 | 0.081 | ||
| SI250 | 250 | 60 | 1.18 | 1.29 | 0.096 | ||
| SID160z | 160 | 60 | 0.74 | 1.19 | 0.069 | ||
| SID200z | 200 | 53 | 0.82 | 1.24 | 0.081 | ||
| SID230z | 230 | 52 | 0.93 | 1.27 | 0.09 | ||
| SID270z | 270 | 50 | 1.06 | 1.32 | 0.102 | ||
| SID311z/ FTD311z | 311 | 45 | 1.11 | 1.37 | 0.114 | ||
| SID350z/ FTD350z | 350 | 45 | 1.26 | 1.41 | 0.126 | ||
| SID380z/ FTD380z | 380 | 40 | 1.22 | 1.45 | 0.136 | ||
Illustration of Eccospheres® for use in 5G antenna base stations
Trelleborg has worked with engineers to design materials that lower dielectric properties and ensure radar signal transparency while also reducing overall system weight by using Eccospheres® within a resin system.
Eccospheres® within a resin enables high frequency communication, increased signal speed, and lower signal loss, due to the customizable low dielectric design and increased signal transparency.
