Isolast® PureFab® FFKM

The Isolast® PureFab® range provides the best performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning, and thermal processing such as atomic layer deposition.

The range comprises of leading-edge Perfluoroelastomers (FFKMs) that offer unique properties including high-temperature stability, high purity, exceptionally low trace metal content, and outstanding plasma resistance. This leads to reduced particle generation and ultra-low outgassing performance in high vacuum conditions, enabling end-users to extend their product maintenance cycles while ensuring that process yield is maximized.

To ensure purity of product, all Isolast® PureFab® seals produced and packed in a Class 100 (ISO5) cleanroom environment.

Trelleborg Sealing Solutions offers a unique and focused material portfolio to match process chemistry, system location and tool complexity:

• lsolast® PureFab® JPF10:
  • Fully organic structure
  • High purity
  • Excellent fluorine and oxygen radical plasma resistance
  • Low particle generation
  • High-temperature stability over +300 °C
  • Excellent chemical resistance, including in steam and amines
  • Suitable for processes including dry etching, stripping and remote plasma cleaning

• lsolast® PureFab® JPF20:
  • Advanced nanoparticle filler system providing minimal particle generation
  • Maximum resistance to aggressive ion and radical rich plasma chemistries
  • Excellent high-temperature stability to +320 °C
  • Suitable for use in all etch processes and critical tool locations where there is a requirement for extreme plasma resistance

• Isolast® PureFab® JPF21:
  • Proprietary filler system provides excellent oxygen plasma resistance and dimensional stability
  • Minimum particulation in NF₃ plasma
  • Superior sealing force retention over long durations even at temperatures over +300°C extends seal life
  • Suitable for etch, deposition and diffusion processes

• Isolast® PureFab® JPF30:
  • Non-filled, translucent extreme purity material
  • Extremely low trace metal content
  • Unmatched thermal stability performance compared to competitors’ translucent materials, even at +300 °C
  • Suitable for ash and strip processes as well as applications that require low-sealing force 

Other materials in the Isolast® PureFab® range:

• Isolast® PureFab® J9675:
• Fully organic formulation with excellent resilience
• Ultra-low outgassing performance for advanced node photolithography applications
• Suitable for damping applications where outgassing properties are critical

• Isolast® PureFab® J9685:
  • Outstanding thermal resistance
  • Very low compression set
  • Operates in high-temperature thermal processes up to 325°C
  • Suitable for thermal processes such as ALD, oxidation/diffusion etc 

• Isolast® PureFab® J9610:
  • Superior chemical resistance for wet process applications
  • Very low extractables in aggressive wet process chemicals
  • Suitable for CMP, ECD and wet etch applications

Products:

• O-Rings
• Custom-designed seals including rubber-to-metal and rubber-to-plastic bonded products, such as wafer handling products
• FlexiMold® large-diameter joint free seals
• Centering Rings (NW, KF, ISO)

The Isolast® PureFab® exhibit demonstrates how these materials maximize system uptime of advanced semiconductor processes.

Wide range of FKM elastomers to meet semiconductor needs

Wide range of proprietary PTFE based sealing material