Trelleborg Showcases Innovative Sealing Solutions at Semicon Taiwan 2024
Optimal Solutions for Extreme Environments
Ethan Huang, Semiconductor Segment Manager, Trelleborg Sealing Solutions, says: “As semiconductor environments are increasingly characterized by extreme temperatures and more aggressive chemical precursors, reliable sealing solutions become ever more essential to prevent premature failure. At Semicon Taiwan we will be featuring the latest additions to our semiconductor portfolio specifically engineered to address these challenges.
“Trelleborg customers benefit from premium engineering capabilities to develop the right custom solutions for today’s increasingly extreme fab and sub-fab environments, including the unique ability to model compression set data using finite element analysis. This step change in technology enables engineers to predict the usable lifetime of seals more accurately as they design and manufacture finished products.”
>>Find out more about Trelleborg solutions for semiconductor environments
New Products Enhance Semiconductor Portfolio
Semicon Taiwan marks the show debut of products absorbed into the Trelleborg Sealing Solutions portfolio following the acquisition by Trelleborg Group of leading South Korean manufacturer MNE Group, a manufacturer of high-performance specialty seals for both aftermarket and original equipment manufacturers.
New products include Nanopure® perfluoroelastomer (FFKM) and fluorocarbon (FKM) O-Rings which seal in key processes including chemical vapor deposition (CVD), etch, ash & stripping.
Trelleborg also presents chemical mechanical planarization (CMP) parts including liquid silicone rubber (LSR) and high-consistency rubber (HCR) rolling diaphragms to stabilize the grinding pad and wafer during CMP polishing processes.
Another product brought into the Trelleborg range is the most critical seal in chip manufacturing, bonded slit valve door seals, comprised of dynamic rubber-to-metal bonded seals, for wafer transfer chambers.
>>Download the Semiconductor Polymer Solutions brochure
Cutting-edge High-purity Isolast® PureFab™ Seals
Trelleborg will also showcase the latest additions to the extensive Isolast® PureFab™ range, including JPF40, an ultra-high temperature FFKM developed for demanding subfab applications and thermal processes, including rapid thermal processing (RTP), atomic layer deposition (ALD) and oxidation. It offers unrivaled compression set performance at operating temperatures from +200 °C/+392 °F to +300 °C/+552 °F. This ensures sealing integrity for critical processes, withstanding peak application temperatures over +325 °C/+617 °F, the highest temperature capability of an elastomer material.
Isolast® PureFab™ JPF22 is an excellent all-around FFKM seal with superior chemical compatibility suitable for a wide range of semiconductor applications. The material offers excellent resistance to wet process chemicals and steam, as well as amine-based ALD precursors.
Extensive Engineering Experience and Unique Capabilities
Trelleborg will also demonstrate its extensive and rigorous engineering capabilities, including the unique ability to model the compression set of elastomers to predict seal lifetime using finite element analysis (FEA) for its semiconductor customers. This approach enables engineers to capture more accurate seal compression set data compared to industry standard simulation compression set tests, allowing for more accurate predictions about seal longevity. The extensive ability to work with customers to develop custom seals for specific applications will also be highlighted.
Finally Dr. Murat Gulcur, Technical Director Semiconductor, Trelleborg Sealing Solutions, will also deliver a ‘TechXPOT’ presentation at the show titled ‘Improving tool performance by advanced sealing technologies’. The presentation details why careful material selection, design including FEA simulation and product innovation can help avoid seal failures that can slow or even stop production, leading to productivity loss.