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Plasma processes are fundamental to modern semiconductor manufacturing, enabling the precise etching and deposition required for next-generation devices. These aggressive environments place immense stress on sealing components, demanding exceptional purity and chemical compatibility to maintain process integrity and prevent contamination.
Explore our high-performance sealing solutions used in critical plasma applications and identify the seal locations most relevant to your process.
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Gas Injector Seals
  • Resistance against all process gases
  • High purity
  • Long-term reliability
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Find out more about lsolast® PureFab®
Virtual Showroom

Showerhead Seals
  • Extremely high plasma resistance
  • Best-in-class purity
  • Low trace metal contenty
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Find out more about lsolast® PureFab®
Virtual Showroom

Chamber Lid Seals
  • Ultra-low particle generation
  • Extremely high plasma resistance
  • Best-in-class outgassing performance
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Find out more about lsolast® PureFab®
Virtual Showroom

Window/Viewport Seals
  • Ultra-low outgassing performance
  • Available in various sizes and shapes
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF22
Find out more about lsolast® PureFab®
Virtual Showroom

E-Chuck Seals
  • Ultra-low particle generation
  • Extremely high plasma resistance
  • Best-in-class purity
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF30
Find out more about lsolast® PureFab®
Virtual Showroom

Subfab Processes

These processes, including vacuum pump and abatement applications, require seals that offer:

  • Excellent high-temperature performance
  • Outstanding chemical compatibility
  • Long sealing life

Suitable Materials:
Isolast® PureFab® JPF21
Isolast® PureFab® JPF40
Find out more about lsolast® PureFab®
Virtual Showroom

Deposition Process

These processes require seals that offer:

  • Market-leading outgassing properties
  • Suitable for use with aggressive precursor chemicals
  • Excellent thermal stability
  • Ultra-high leading purity

Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF21
Isolast® PureFab® JPF40
Find out more about lsolast® PureFab®
Virtual Showroom

Dry Etch Process

These processes require seals that offer:

  • Excellent plasma resistance
  • Outstanding plasma crack resistance
  • Low particulation
  • Market-leading purity
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Isolast® PureFab® JPF30
Find out more about lsolast® PureFab®
Virtual Showroom

Isolast®K-Fab™
  • Error-proof Assembly
    A puzzle-shaped connection holds the seal on to the metal insert during handling and assembly
  • High Temperature Capability
    Wide selection of materials enables high-temperature applications up to +327 °C/+621 °F
  • Superior Sealing Performance
    When compressed, the puzzle-shaped design acts as a retention mechanism and increases the axial sealing force when energized
  • Long Service Life
    Double-acting sealing profile increases the sealing performance, especially with varying pressure/vacuum conditions
  • No Overfill or Extrusion
    Compared to an O-Ring, K-Fab™ has significantly less rubber volume which prevents overfill and extrusion due to thermal expansion
Suitable Materials:
Isolast® K-Fab™ Flange Seal Find out more about lsolast® PureFab®

Slit Valve Doors
  • Long-term sealing integrity
  • Excellent plasma resistance
  • Best-in-class outgassing performance
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Isolast® PureFab® JPF30
Isolast® PureFab® JPF40
Find out more about lsolast® PureFab®
Virtual Showroom

Wafer Support and Transfer Pads
  • Low stiction
  • Best-in-class purity
  • Various shapes and designs available
Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF22
Find out more about lsolast® PureFab®
Virtual Showroom

Process Precursor Canister Seals
  • Low permeation
  • High purity
Compatible with all gases including amine-based substances, e.g. TDMAT Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF40
Find out more about lsolast® PureFab®
Virtual Showroom

Process Gas Delivery Valve Seals
  • Compatible with all process gases
  • High purity
  • Long-term reliability
Compatible with all gases including amine-based substances, e.g. TDMAT Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF20
Isolast® PureFab® JPF22
Find out more about lsolast® PureFab®
Virtual Showroom

Main Chamber Body Seals
  • Ultra-low outgassing performance
  • Low permeation
  • Full range of sizes including Fleximold™ large diameter seals
Compatible with all gases including amine-based substances, e.g. TDMAT Suitable Materials:
Isolast® PureFab® JPF10
Isolast® PureFab® JPF22
Find out more about lsolast® PureFab®
Virtual Showroom
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Match plasma conditions to the right sealing selection criteria

Different semiconductor process conditions have different impacts on the sealing solution. There are various parameters to be evaluated, depending on the process condition and the application. This overview gives an idea of what our polymer experts will investigate together with you to make educated sealing decisions. 
Process condition Sealing challenges What to evaluate
Reactive plasma chemistry Chemical attack, erosion or volatile by-products Material compatibility and comparative plasma resistance
Energetic ion exposure Physical sputtering and surface damage Seal location, exposure mode and erosion behavior
Elevated temperature Loss of sealing force or permanent deformation Thermal capability and compression-set behavior
High vacuum Leakage and outgassing risk Seal design, surface condition, material purity and vacuum performance
Repeated cleaning cycles Cumulative chemical, thermal and mechanical degradation Production and cleaning recipes across the full maintenance cycle

From process conditions to a material recommendation

A useful seal recommendation starts with the complete exposure profile. Here's some guidance on what information our semiconductor materials experts need to identify the optimal solution for you: Chamber configuration and seal location.
  • Production gases, plasma type (in-situ plasma or remote plasma) and chamber-cleaning chemistry.
  • Plasma source, RF power, pressure, temperature, gasflow and exposure duration.
  • Seal geometry, groove design, compression and static or dynamic motion.
  • Purity, particles, outgassing and performance requirements.
Share your application-specific requirements and connect with our experts to find out more. Plasma performance cannot be judged from chemistry alone. Reviewing various requirements and targets together supports a more reliable selection process that gives you confidence.
Discuss your plasma application with our semiconductor sealing experts

Technical questions and answers

  • Går EPDM med reduceret CO2-aftryk på kompromis med ydeevnen?
    Nej, disse elastomerer har samme anvendelsesegenskaber som traditionelle EPDM'er.
  • Hvilke vedvarende råvarer anvendes i EPDM-elastomerer med reduceret CO2-aftryk?
    Vi anvender bio-cirkulære råvarer, der stammer fra vedvarende kilder som brugt madolie, skovbrugsaffald og tallolie. Der indgår også genanvendte fyldstoffer fra udtjente dæk.
  • Hvordan reducerer disse elastomerer et produkts CO2-aftryk?
    Ved at erstatte fossile råmaterialer med bio-cirkulære og genanvendte råvarer reducerer disse avancerede løsninger produktets CO2-aftryk betydeligt.
  • Hvor anvendes EPDM-elastomerer med reduceret CO2-aftryk?
    EPDM-elastomerer med reduceret CO2-aftryk anvendes i tætningsløsninger på tværs af brancher som bilindustrien, energi, vandforsyning og industriel produktion, hvor både holdbarhed og funktionalitet er afgørende.
  • Hvor anvendes EPDM-elastomerer med reduceret CO2-aftryk?
    EPDM-elastomerer med reduceret CO2-aftryk anvendes i tætningsløsninger på tværs af brancher som bilindustrien, energi, vandforsyning og industriel produktion, hvor både holdbarhed og funktionalitet er afgørende.