Trelleborg exhibits latest sealing innovations at SEMICON Europa 2026
Date: 30.10.26
Trelleborg Sealing Solutions exhibits advanced products and capabilities for semiconductor applications at SEMICON Europa in Munich, Germany, November 10 to 13, at booth C1329.
>>Discover Trelleborg solutions for semiconductor manufacturing
Chris Busby, Global Segment Director, says: “Current semiconductor trends like AI, increased scale, the growth of data centers and high-bandwidth memory demand innovation from manufacturers. Advanced sealing materials play a key role in enabling these trends while reducing total cost of ownership. At SEMICON Europa we showcase the latest additions to our sealing material portfolio to help address challenges faced by original equipment manufacturers and end users.”
Fluorosurfactant-free solutions
On display are the recently launched Trelleborg PureFab® fluorosurfactant-free (FSF) materials, ensuring high purity and low contamination while offering exceptional durability. They have ultra-low outgassing characteristics and exceptional performance at high temperatures.
>>Find out more about FSF solutions
Busby adds: “Many high-performance fluoroelastomers (FKMs) and perfluorocarbon rubbers (FFKMs) rely on fluorosurfactants during the polymerization process. While effective for manufacturing these complex polymers, fluorosurfactants are facing increasing global scrutiny due to their environmental persistence. Our next-generation fluorosurfactant-free materials - two FFKMs JPF50 and JPF58, and FKM VPF20 - function without any compromise on the materials’ performance and durability.”
Premium semiconductor sealing options
Also featured is the extensive Isolast® PureFab® range which provides excellent performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning and thermal processing such as atomic layer deposition. Comprising leading-edge FFKMs, the PureFab® range offers unique properties including high-temperature stability, high purity, exceptionally low-trace-metal content and outstanding plasma resistance. This results in reduced particle generation and ultra-low outgassing performance in high vacuum conditions.
>>Discover the Isolast® PureFab® range
Other products on display critical to sealing in chip manufacturing are bonded slit valve seals comprised of dynamic rubber-to-metal bonded seals for wafer transfer chambers. These valve seals demonstrate high wear resistance coupled with ultra-low outgassing qualities and are suited for high-volume manufacturing.
Optimum vacuum pump sealing
Also featured are Turcon® Varilip® PDR rotary seals for vacuum pumps, which are characterized by low friction and stick-slip-free running, and reduce temperature generation, permit higher peripheral speeds and lower power consumption. Tests show that this seal requires only around 50 percent of the torque of a radial shaft seal when running in Fomblin® oil, commonly used in semiconductor vacuum pumps. This results in a long service life, maximizing mean time between planned maintenance cycles for greater productivity.
>>Discover Turcon® Varilip® PDR rotary seals
Trelleborg also showcases flange seal solutions in a variety of application-specific products. Turcon® Variseal® NW, with its Turcon® case encompassing an energizing spring, eliminates the possibility of contact between the spring or spring cavity and system media, and is ideal for vacuum and fluorine gas applications. The FFKM Isolast® K-Fab™ flange seal is resistant to extreme temperatures and complex chemistries, and the elastomer element uses far less material than traditional O-Rings, improving the seal’s thermal properties and eliminating thermal expansion and groove overfill. Standard and custom O-Ring centering ring solutions for vacuum flange systems are also available, featuring FKM and Isolast® PureFab FFKM® materials designed for critical semiconductor sealing environments.
Advanced engineering capabilities
Additionally, Trelleborg demonstrates its extensive and rigorous engineering capabilities, including the ability to model the compression set of elastomers to predict seal lifetime using finite element analysis (FEA) for its semiconductor customers.
Busby notes: “This approach enables engineers to capture more accurate seal compression set data compared to industry standard simulation compression set tests, allowing for more accurate predictions about seal longevity. Our extensive ability to work with customers to develop custom seals for specific applications will also be highlighted.”
>>Contact a semiconductor sealing expert
Chris Busby, Global Segment Director, says: “Current semiconductor trends like AI, increased scale, the growth of data centers and high-bandwidth memory demand innovation from manufacturers. Advanced sealing materials play a key role in enabling these trends while reducing total cost of ownership. At SEMICON Europa we showcase the latest additions to our sealing material portfolio to help address challenges faced by original equipment manufacturers and end users.”
Fluorosurfactant-free solutions
On display are the recently launched Trelleborg PureFab® fluorosurfactant-free (FSF) materials, ensuring high purity and low contamination while offering exceptional durability. They have ultra-low outgassing characteristics and exceptional performance at high temperatures.
>>Find out more about FSF solutions
Busby adds: “Many high-performance fluoroelastomers (FKMs) and perfluorocarbon rubbers (FFKMs) rely on fluorosurfactants during the polymerization process. While effective for manufacturing these complex polymers, fluorosurfactants are facing increasing global scrutiny due to their environmental persistence. Our next-generation fluorosurfactant-free materials - two FFKMs JPF50 and JPF58, and FKM VPF20 - function without any compromise on the materials’ performance and durability.”
Premium semiconductor sealing options
Also featured is the extensive Isolast® PureFab® range which provides excellent performance in aggressive front-end processes including deposition, etch, ash/strip, plasma cleaning and thermal processing such as atomic layer deposition. Comprising leading-edge FFKMs, the PureFab® range offers unique properties including high-temperature stability, high purity, exceptionally low-trace-metal content and outstanding plasma resistance. This results in reduced particle generation and ultra-low outgassing performance in high vacuum conditions.
>>Discover the Isolast® PureFab® range
Other products on display critical to sealing in chip manufacturing are bonded slit valve seals comprised of dynamic rubber-to-metal bonded seals for wafer transfer chambers. These valve seals demonstrate high wear resistance coupled with ultra-low outgassing qualities and are suited for high-volume manufacturing.
Optimum vacuum pump sealing
Also featured are Turcon® Varilip® PDR rotary seals for vacuum pumps, which are characterized by low friction and stick-slip-free running, and reduce temperature generation, permit higher peripheral speeds and lower power consumption. Tests show that this seal requires only around 50 percent of the torque of a radial shaft seal when running in Fomblin® oil, commonly used in semiconductor vacuum pumps. This results in a long service life, maximizing mean time between planned maintenance cycles for greater productivity.
>>Discover Turcon® Varilip® PDR rotary seals
Trelleborg also showcases flange seal solutions in a variety of application-specific products. Turcon® Variseal® NW, with its Turcon® case encompassing an energizing spring, eliminates the possibility of contact between the spring or spring cavity and system media, and is ideal for vacuum and fluorine gas applications. The FFKM Isolast® K-Fab™ flange seal is resistant to extreme temperatures and complex chemistries, and the elastomer element uses far less material than traditional O-Rings, improving the seal’s thermal properties and eliminating thermal expansion and groove overfill. Standard and custom O-Ring centering ring solutions for vacuum flange systems are also available, featuring FKM and Isolast® PureFab FFKM® materials designed for critical semiconductor sealing environments.
Advanced engineering capabilities
Additionally, Trelleborg demonstrates its extensive and rigorous engineering capabilities, including the ability to model the compression set of elastomers to predict seal lifetime using finite element analysis (FEA) for its semiconductor customers.
Busby notes: “This approach enables engineers to capture more accurate seal compression set data compared to industry standard simulation compression set tests, allowing for more accurate predictions about seal longevity. Our extensive ability to work with customers to develop custom seals for specific applications will also be highlighted.”
>>Contact a semiconductor sealing expert