From plasma resistance to thermal stability, our materials are proven to perform under the harsh realities of semiconductor manufacturing, helping you protect process yield, extend maintenance intervals and lower total cost of ownership.
Material testing for confident sealing decisions
Our laboratories give you clear, measurable proof of how a material will perform in your application. Each test targets a specific risk in semiconductor processing, from contamination and outgassing to mechanical wear and thermal breakdown. Together, they help us engineer sealing solutions you can rely on and give you the data to make confident decisions.
Plasma resistance testing for semiconductor seals
Plasma is one of the most aggressive environments a seal can face. Our plasma resistance testing exposes materials to reactive gases such as O₂, NF₃, and CF₄ and then evaluates their ability to withstand plasma-induced erosion and degradation over time.
Why it matters: plasma attack causes erosion, particle generation and outgassing, all of which threaten wafer yield and process stability. By measuring etching resistance directly, we identify the materials that stay clean and intact under real plasma conditions.
How you benefit: validated confidence that your seals resist plasma attack, minimize particle generation and support consistent, high-yield performance in your most demanding etch and deposition steps.
Why it matters: plasma attack causes erosion, particle generation and outgassing, all of which threaten wafer yield and process stability. By measuring etching resistance directly, we identify the materials that stay clean and intact under real plasma conditions.
How you benefit: validated confidence that your seals resist plasma attack, minimize particle generation and support consistent, high-yield performance in your most demanding etch and deposition steps.
Compression set testing
Compression set measures how much a material permanently deforms after being held under compression, the key indicator of long-term sealing force. We test across a wide temperature range, from room temperature up to +300°C/+572 °F.
Why it matters: a seal that loses its shape loses its ability to seal. Low compression set at high temperatures means your components keep sealing reliably through thermal cycling and extended service.
How you benefit: proof that our materials retain resilience under heat and pressure, helping you extend maintenance intervals and reduce unplanned downtime.
Why it matters: a seal that loses its shape loses its ability to seal. Low compression set at high temperatures means your components keep sealing reliably through thermal cycling and extended service.
How you benefit: proof that our materials retain resilience under heat and pressure, helping you extend maintenance intervals and reduce unplanned downtime.
SEM/EDS analysis
Scanning electron microscopy paired with energy dispersive spectroscopy (SEM/EDS) produces high-resolution images and precise elemental analysis of particles, contaminants and material structure.
Why it matters: in ultra-clean semiconductor processes, even microscopic contamination can compromise a wafer. SEM/EDS lets us identify the exact composition and source of any particle or inclusion.
How you benefit: detailed insight into material purity and contamination, so we can refine formulations and help you maintain the cleanliness your processes demand.
Why it matters: in ultra-clean semiconductor processes, even microscopic contamination can compromise a wafer. SEM/EDS lets us identify the exact composition and source of any particle or inclusion.
How you benefit: detailed insight into material purity and contamination, so we can refine formulations and help you maintain the cleanliness your processes demand.
Thermogravimetric analysis (TGA)
Thermogravimetric analysis measures how a material's weight changes as temperature rises, allowing us to determine filler content and thermal decomposition behavior.
Why it matters: filler type and content directly influence a seal's strength, purity and thermal performance. Understanding decomposition helps us confirm a material will hold up at operating temperature.
How you benefit: accurate characterization of material composition and thermal limits, supporting consistent quality and dependable performance in your applications.
Why it matters: filler type and content directly influence a seal's strength, purity and thermal performance. Understanding decomposition helps us confirm a material will hold up at operating temperature.
How you benefit: accurate characterization of material composition and thermal limits, supporting consistent quality and dependable performance in your applications.
Differential scanning calorimetry (DSC)
Differential scanning calorimetry identifies key thermal transitions in a material, including its glass transition temperature (Tg) and melting point (Tm).
Why it matters: these transition points define the temperature window in which a material stays flexible and reliable. Knowing them helps us match the right material to your process conditions.
How you benefit: clear thermal profiles that guide material selection, so seals perform predictably across the full temperature range of your operation.
Why it matters: these transition points define the temperature window in which a material stays flexible and reliable. Knowing them helps us match the right material to your process conditions.
How you benefit: clear thermal profiles that guide material selection, so seals perform predictably across the full temperature range of your operation.
Moving die rheometer (MDR)
The moving die rheometer measures how a rubber compound cures, including scorch time (ts2) and optimum press cure conditions (tc90, temperature and time).
Why it matters: correct curing is the foundation of consistent seal quality. Precise cure data ensures every batch is processed to deliver the same reliable properties.
How you benefit: repeatable, well-controlled manufacturing that translates into consistent seal performance you can count on.
Why it matters: correct curing is the foundation of consistent seal quality. Precise cure data ensures every batch is processed to deliver the same reliable properties.
How you benefit: repeatable, well-controlled manufacturing that translates into consistent seal performance you can count on.
Universal testing machine (UTM) - tensile, elongation and modulus
The universal testing machine measures core mechanical properties, including tensile strength, elongation at break and 100% modulus.
Why it matters: these values tell us how a material handles stress, stretch and load during installation and service. Strong, resilient materials resist damage and last longer.
How you benefit: verified mechanical performance that supports durable, reliable seals in demanding semiconductor environments.
Why it matters: these values tell us how a material handles stress, stretch and load during installation and service. Strong, resilient materials resist damage and last longer.
How you benefit: verified mechanical performance that supports durable, reliable seals in demanding semiconductor environments.
From test data to material recommendation
A useful material evaluation starts with the semiconductor application, not the laboratory instrument.
Our materials and application engineers first identify the operating conditions and the performance question that needs to be answered. They then select the tests that can generate the most relevant comparative evidence.
This process helps ensure that testing addresses the actual engineering question rather than generating isolated material data without sufficient application context.
Our materials and application engineers first identify the operating conditions and the performance question that needs to be answered. They then select the tests that can generate the most relevant comparative evidence.
This process helps ensure that testing addresses the actual engineering question rather than generating isolated material data without sufficient application context.
Partner with our materials experts
Our test capabilities are more than laboratory equipment. They are how we turn materials science into sealing solutions you can trust, backed by data and global support. To learn how our research and development expertise can strengthen your semiconductor processes, get in touch with our experts.
Technical questions and answers
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Går EPDM med reduceret CO2-aftryk på kompromis med ydeevnen?Nej, disse elastomerer har samme anvendelsesegenskaber som traditionelle EPDM'er.
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Hvilke vedvarende råvarer anvendes i EPDM-elastomerer med reduceret CO2-aftryk?Vi anvender bio-cirkulære råvarer, der stammer fra vedvarende kilder som brugt madolie, skovbrugsaffald og tallolie. Der indgår også genanvendte fyldstoffer fra udtjente dæk.
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Hvordan reducerer disse elastomerer et produkts CO2-aftryk?Ved at erstatte fossile råmaterialer med bio-cirkulære og genanvendte råvarer reducerer disse avancerede løsninger produktets CO2-aftryk betydeligt.
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Hvor anvendes EPDM-elastomerer med reduceret CO2-aftryk?EPDM-elastomerer med reduceret CO2-aftryk anvendes i tætningsløsninger på tværs af brancher som bilindustrien, energi, vandforsyning og industriel produktion, hvor både holdbarhed og funktionalitet er afgørende.
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Hvor anvendes EPDM-elastomerer med reduceret CO2-aftryk?EPDM-elastomerer med reduceret CO2-aftryk anvendes i tætningsløsninger på tværs af brancher som bilindustrien, energi, vandforsyning og industriel produktion, hvor både holdbarhed og funktionalitet er afgørende.
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Hvor anvendes EPDM-elastomerer med reduceret CO2-aftryk?EPDM-elastomerer med reduceret CO2-aftryk anvendes i tætningsløsninger på tværs af brancher som bilindustrien, energi, vandforsyning og industriel produktion, hvor både holdbarhed og funktionalitet er afgørende.